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BT) In
addition to some of the standard sizes like .062
thick PCB and .032 thick FR4 PCB, we offer thin
film clad material. We can make the
material as small as 4 mil and 5 mil (.004" -
.005") as a core thickness for the G10 FR
substrate.

Another
option for the copper clad laminate is our
Ultraviolet (UV) Blocking chemical that we can
add to the FR4 that blocks out the full spectrum
of light up to 405 nm.
We offer a
High-temperature copper clad laminate in FR5
compliant to IPC 4101/23 for more
sophisticated circuitry.
The High Temp clad material has a higher thermal
range for use in high frequency and burn-in
boards.
There are many
applications for the copper cladding on the G10
material such as : Antennas, RFI/EFI and
Microwave products that need a low dissipation
factor. Broadband, Telecom, Consumer Electronics
... just about everywhere electronic circuits
are needed.
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